English
IPC-7525 defines solder paste stencil design — aperture shape, aspect ratio, area ratio, and thickness. The stencil is the single most important factor in solder paste printing quality. Superb's stencil designs follow IPC-7525 for reliable paste rele
Clean machine for stencil. Automated removal of dried solder paste from fine-pitch apertures. Clean stencils = consistent paste release = higher first-pass yield.